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海郑实业（上海）有限公司
主营：电缆组件,3M2131,1KV灌胶接头,快速修复电缆 - 18964999379
海郑实业（上海）有限公司
主营：电缆组件,3M2131,1KV灌胶接头,快速修复电缆
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Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized LCDs
Suitable for direct mounting of driver IC which drives a flat panel display onto glass substrate.
With both excellent conductivity and insulating property between terminals for fine pitch connection.
Anisotropic Conductive Film (ACF)
Please select the product name :
CP6920F/CP6920F3
CP30941-20AB
CP6920F/CP6920F3 | |
For small-to-medium-sized LCDs | |
AV/ Game machines/ Cellular phones/ Automobiles
| |
Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal. With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time. High reliability by excellent Anti-migration feature. The 2 layer structure of ACF accommodates adhesive layer and non-conductive layer which efficiently trap conductive particles and compatible for fine pitch application.
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Product Name | CP6920F | CP6920F3 | |
Type | COG | COG | |
Connection material | IC | IC | |
ITO Glass | ITO Glass | ||
Minimum space (μm) *1 | 15 | 12 | |
Minimum pitch (μm) *2 | - | - | |
Minimum connection area (μm2) *3 | 1800 | 1300 | |
Thickness (μm) | 20 | 20 | |
Conductive particles | Type | Au/Ni plating on a polymer core particle with insulation | Au/Ni plating on a polymer core particle with insulation |
Particle diameter (μmΦ) | 4 | 3 | |
Insulation coated particle | Yes | Yes | |
ACF Laminating conditions | Temperature (°C) *4 | 60 to 80 | 60 to 80 |
Time (sec) *5 | 1 to 2 | 1 to 2 | |
Pressure (MPa) *6 | 0.3 to 1.0 | 0.3 to 1.0 | |
Main bonding conditions | Temperature (°C) *4 | 190 to 230 | 190 to 230 |
Time (sec) *5 | 5 | 5 | |
Pressure (MPa) *7 | 60 to 80 | 60 to 80 | |
*1Minimum space: Space between neighboring circuits.
*2Minimum pitch: Total length of conductor width and space between neighboring circuits.
*3Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.
*4Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.
*5Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.
*6Pressure of ACF lamination: It is described as the area of ACF lamination.
*7Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.
Interconnect a small-to-medium-sized LCD with an IC chip.
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
